![]() ![]() Throughout APEC, TI power experts will lead 38 industry and technical sessions to address power management design challenges. ![]() In addition, TI will showcase system-level gallium nitride (GaN) and silicon carbide (SiC) solutions for increasing power density and efficiency. TI will showcase the newest additions to its power-management portfolio with stand-alone low-EMI active filter designs featuring the TPSF12C1-Q1 at the 2023 Applied Power Electronics Conference (APEC) March 19-23. See low-EMI and high power-density designs at APEC 2023. With supporting tools, such as PSpice® for TI simulation models and quick-start calculators, designers can easily select and implement the optimal components for their system. TI's active EMI filter ICs meet IEC 6 surge immunity requirements, thus minimizing the need for external protection components, such as transient voltage suppression (TVS) diodes. Therefore, engineers will be able to address EMI design challenges and meet CISPR 11, CISPR 32 and CISPR 25 EMI requirements. The TPSF12C1, TPSF12C3, TPSF12C1-Q1, and TPSF12C3-Q1 help detect, process and reduce EMI in a broad range of AC/DC power supplies, on-board chargers, servers, UPS and other similar systems where common-mode noise dominates. Mitigate common-mode emissions to meet stringent EMI standards.Ĭomité International Spécial des Perturbations Radioélectriques (CISPR) standards are the global benchmark for limiting EMI in electrical and electronic devices. Offered in a SOT-23 14-pin package, the IC integrates compensation and protection circuitry to further reduce the implementation complexity and minimize the number of external components. The new active EMI filter ICs incorporate sensing, filtering, gain and injection stages. These devices can efficiently reduce the heat generated in a power-supply EMI filter, which also extends filter capacitor lifetimes and increases system reliability. The new family of active EMI filter ICs consists of the TPSF12C1 and TPSF12C3 for single- and three-phase commercial applications and TPSF12C1-Q1 and TPSF12C3-Q1 for automotive applications. Through capacitive amplification, these new active EMI filter ICs enable engineers to shrink the inductance value of common-mode chokes by as much as 80%, helping to cost-effectively achieve improved mechanical reliability and increased power density. One of the main challenges when designing high-density switching regulators is how to implement a compact and efficient design of the EMI input filter. Significantly reduce system size, weight and cost and improve reliability. This capability enables designers to reduce the size of chokes by 50%, compared to purely passive filter solutions, and meet stringent EMI requirements.įor more information on TI's new power-supply filter ICs portfolio. ![]() With innovative developments from Kilby Labs, TI's research and development labs for new concepts and breakthrough ideas, the new portfolio of stand-alone active EMI filter ICs can sense and cancel common-mode EMI by as much as 30 dB at frequencies between 100 kHz and 3 MHz in single- and three-phase AC power systems. As electrical systems become increasingly dense and interconnected, mitigating EMI is a critical system design consideration for engineers. Texas Instruments Incorporated (TI) debuted the industry's first stand-alone active electromagnetic interference (EMI) filter integrated circuits (ICs), enabling engineers to implement smaller, lighter EMI filters, to enhance system functionality at reduced system cost while simultaneously meeting EMI regulatory standards. ![]()
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